论文信息 - Simulation-based defect printability analysis on attenuated phase-shifting masks

Simulation-based defect printability analysis on attenuated phase-shifting masks

Simulated wafer images for Attenuated Phase Shift Mask (ATTPSM) features are performed by the Virtual Stepper System. The ATTPSM test reticles were prepared with programmed defects (hard defects and phase defects) on line/space patterns, contact hole patterns, and rectangle patterns for 150-nm design rules. Each defect area was inspected using KLA-Tencor's UV-HR365 and SLF27 inspection systems. Virtual Stepper simulations are compared with Aerial Image Measurement System (AIMSTM) simulation at best focus and at multiple defocus levels. In addition, simulation accuracy from different inspection images is compared.

Qi-De Qian | Naoya Hayashi | Nobuhito Toyama | Linyong Pang | Kevin K. Chan

[1] Ichiro Kagami,et al. Simulation-based defect printability analysis for 0.13-μm technology , 2001, Photomask Japan.

[2] Linard Karklin,et al. Comparison of binary mask defect printability analysis using virtual stepper system and aerial image microscope system , 1999, Photomask Technology.

[3] Benjamin George Eynon,et al. Defect dispositioning using mask printability on attenuated phase-shift production photomasks , 2001, SPIE Photomask Technology.

[4] Ichiro Kagami,et al. Defect printability analysis of attenuated PSM using PASStm , 2002, SPIE Photomask Technology.

[5] Linard Karklin,et al. Wafer printability simulation accuracy based on UV optical inspection images of reticle defects , 1999, Advanced Lithography.

[6] Derek B. Dove,et al. Development and application of a new tool for lithographic mask evaluation, the stepper equivalent Aerial Image Measurement System, AIMS , 1997, IBM J. Res. Dev..