A comparative study of the bonding energy in adhesive wafer bonding
暂无分享,去创建一个
Göran Stemme | Niclas Roxhed | Farizah Saharil | Tommy Haraldsson | Fredrik Forsberg | Frank Niklaus | W. van der Wijngaart | T. Haraldsson | N. Roxhed | G. Stemme | F. Niklaus | F. Forsberg | W. Wijngaart | F. Saharil
[1] G. Stemme,et al. Low temperature full wafer adhesive bonding , 2001 .
[2] T. Ohba,et al. Thinned wafer multi-stack 3DI technology , 2010 .
[3] F. Tay,et al. Adhesive bonding with SU-8 at wafer level for microfluidic devices , 2006 .
[4] R. Gutmann,et al. Adhesive wafer bonding , 2006 .
[5] Mikael Antelius,et al. Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor , 2013 .
[6] G. Stemme,et al. CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration , 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.
[7] Jan Vanfleteren,et al. Adhesive bonding by SU-8 transfer for assembling microfluidic devices , 2012 .
[8] J. Oberhammer,et al. BCB contact printing for patterned adhesive full-wafer bonded 0-level packages , 2005, Journal of Microelectromechanical Systems.
[9] Babak Ziaie,et al. Silicon wafer bonding through RF dielectric heating , 2003 .
[10] Robert M. Young,et al. Fabrication of micronozzles using low-temperature wafer-level bonding with SU-8 , 2003 .
[11] T. Kenny,et al. What is the Young's Modulus of Silicon? , 2010, Journal of Microelectromechanical Systems.
[12] Jian-Qiang Lu,et al. Critical Adhesion Energy at the Interface Between Benzocyclobutene and Silicon Nitride Layers , 2007 .
[13] M. Reiche,et al. Wafer bonding for microsystems technologies , 1999 .
[14] Frank Niklaus,et al. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS , 2011, IEEE Journal of Selected Topics in Quantum Electronics.
[15] Paolo Bettotti,et al. Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer , 2013 .
[16] Philippe Regreny,et al. III-V/Si photonics by die-to-wafer bonding , 2007 .
[17] R. Ghodssi,et al. Microfluidic systems with on-line UV detection fabricated in photodefinable epoxy , 2001 .
[18] Eun Sok Kim,et al. Film transfer and bonding technique to cover lab on a chip , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..
[19] I. Lyashenko,et al. Statistical theory of the boundary friction of atomically flat solid surfaces in the presence of a lubricant layer , 2012 .
[20] Göran Stemme,et al. Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs , 2009 .
[21] Göran Stemme,et al. SMA Microvalves for Very Large Gas Flow Control Manufactured Using Wafer-Level Eutectic Bonding , 2012, IEEE Transactions on Industrial Electronics.
[22] Hsiharng Yang,et al. A low-temperature wafer bonding technique using patternable materials , 2002 .
[23] Niclas Roxhed,et al. High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers , 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
[24] C. Harendt,et al. Silicon fusion bonding and its characterization , 1992 .
[25] A. Jourdain,et al. Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices , 2005 .
[26] R. Kumar,et al. 200-mm wafer-scale transfer of 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates , 2005, IEEE Electron Device Letters.
[27] M. Tijero,et al. Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding , 2004 .
[28] Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration , 2013, 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS).
[29] Jian-Qiang Lu,et al. Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers , 2006 .