An analytical model of the material removal rate between elastic and elastic-plastic deformation for a polishing process

This paper develops an analytical model for the material removal rate during specimen polishing. The model is based on the micro-contact elastic mechanics, micro-contact elastic-plastic mechanics and abrasive wear theory. The micro-contact elastic mechanics between the pad-specimen surfaces used the Greenwood and Williamson elastic model. The micro-contact elastic-plastic mechanics between specimen and particle, as well as the micro-contact elastic mechanics between particle and pad, are also analyzed. The cross-sectional area of the worn groove in the specimen is considered as trapezoidal area. A close-form solution of material removal rate from the specimen surface is the function of average diameter of slurry particles, pressure, the specimen/pad sliding velocity, Equivalent Young’s modulus, RMS roughness of the pad, and volume concentration of the slurry particle.

[1]  J. Greenwood,et al.  Contact of nominally flat surfaces , 1966, Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences.

[2]  E. Rabinowicz,et al.  Friction and Wear of Materials , 1966 .

[3]  J. Ruan,et al.  Lapping and polishing process for obtaining super-smooth surfaces of quartz crystal , 2003 .

[4]  Shih-Chieh Lin,et al.  A study of the effects of polishing parameters on material removal rate and non-uniformity , 2002 .

[5]  Yongwu Zhao,et al.  A micro-contact and wear model for chemical-mechanical polishing of silicon wafers , 2002 .

[6]  Abhijit Chandra,et al.  A plasticity-based model of material removal in chemical-mechanical polishing (CMP) , 2001 .

[7]  D. Bogy,et al.  An Elastic-Plastic Model for the Contact of Rough Surfaces , 1987 .

[8]  Tadatomo Suga,et al.  Development of a New Mechanochemical Polishing Method with a Polishing Film for Ceramic Round Bars , 1992 .

[9]  B. Bhushan,et al.  Effects of particle size, polishing pad and contact pressure in free abrasive polishing , 1996 .

[10]  Fritz Klocke,et al.  Material Removal Mechanisms in Lapping and Polishing , 2003 .

[11]  F. W. Preston.  The Theory and Design of Plate Glass Polishing Machines , 1927 .

[12]  J. Larsen-Basse,et al.  Probable role of abrasion in chemo-mechanical polishing of tungsten , 1999 .

[13]  S. Ramarajan,et al.  Modification of the Preston equation for the chemical-mechanical polishing of copper , 1998 .

[14]  Yiu-Wing Mai,et al.  Material removal in the optical polishing of hydrophilic polymer materials , 2000 .

[15]  Chih-Cheng Wang,et al.  A material removal model for polishing glass–ceramic and aluminum magnesium storage disks , 2002 .

[16]  David Dornfeld,et al.  Material removal mechanism in chemical mechanical polishing: theory and modeling , 2001 .

[17]  Ming Jiang,et al.  Application of Taguchi method for optimization of finishing conditions in magnetic float polishing (MFP) , 1997 .