Substrate integrated waveguide with corrugated wall

In this work we propose a new SIW structure, called the corrugated SIW (CSIW), which does not require conducting vias to achieve TE10 type boundary conditions at the side walls. Instead, the vias are replaced by quarter wavelength microstrip stubs arranged in a corrugated pattern on the edges of the waveguide. This, along with series interdigitated capacitors, results in a waveguide section comprising two separate conductors, which facilitates shunt connection of active components such as Gunn diodes.