Hot Chips 2020 Posters
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Hyesoon Kim | Fares Elsabbagh | Priyadarshini Roshan | Ethan Lyons | Da Eun Shim | Sung Kyu Lim | Blaise Tine | Apurve Chawda | Will Gulian | Yaotian Feng | Lingjun Zhu
[1] Joel Silberman,et al. A Scalable Multi- TeraOPS Deep Learning Processor Core for AI Trainina and Inference , 2018, 2018 IEEE Symposium on VLSI Circuits.
[2] Hoi-Jun Yoo,et al. 7.7 LNPU: A 25.3TFLOPS/W Sparse Deep-Neural-Network Learning Processor with Fine-Grained Mixed Precision of FP8-FP16 , 2019, 2019 IEEE International Solid- State Circuits Conference - (ISSCC).
[3] Hoi-Jun Yoo,et al. A 1.32 TOPS/W Energy Efficient Deep Neural Network Learning Processor with Direct Feedback Alignment based Heterogeneous Core Architecture , 2019, 2019 Symposium on VLSI Circuits.
[4] Hoi-Jun Yoo,et al. 7.4 GANPU: A 135TFLOPS/W Multi-DNN Training Processor for GANs with Speculative Dual-Sparsity Exploitation , 2020, 2020 IEEE International Solid- State Circuits Conference - (ISSCC).
[5] Chia-Hsiang Yang,et al. A 2.25 TOPS/W Fully-Integrated Deep CNN Learning Processor with On-Chip Training , 2019, 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC).
[6] Seungkyu Choi,et al. A 47.4µJ/epoch Trainable Deep Convolutional Neural Network Accelerator for In-Situ Personalization on Smart Devices , 2019, 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC).