Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder
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Tomohiro Yamakawa | Kunio Shiokawa | Hiroshi Nishikawa | Tadashi Takemoto | Masayoshi Shimoda | H. Nishikawa | T. Takemoto | Kunio Shiokawa | T. Yamakawa | M. Shimoda
[1] M. Nagano,et al. Mechanical Properties and Microstructure of Sn-Ag-Cu-Ni-Ge Lead Free Solder , 2005 .
[2] Jenn-Ming Song,et al. Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications , 2007 .
[3] M. Rettenmayr,et al. High Melting Pb‐Free Solder Alloys for Die‐Attach Applications , 2005 .
[4] Jenn-Ming Song,et al. Thermal and Tensile Properties of Bi-Ag Alloys , 2007 .
[5] I. Shohji,et al. Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode , 2008 .
[6] Jenn-Ming Song,et al. Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates , 2006 .