Low-cost fabrication of optical subassemblies

The optical subassembly is a major contributor to the cost of a fiberoptic computer data link. A technology for low-cost fabrication of optical subassemblies is described, with emphasis on the transmitter subassembly. A factor of three cost reduction is achieved by limiting the parts count to only three: a laser or receiver chip packaged in a TO-can, a plastic housing, and a plastic aspheric lens; and by employment of a fast, automated active-alignment and subsequent fixing technique. Key enabling features include the rise of precision injection molding of specially chosen plastics, an aspheric lens design which permits wide positional variations in the axial direction, and curing of a fast setting epoxy through the use of RF power. A tool was constructed which produced subassemblies at high yield having satisfactory performance.

[1]  Ronald Lee Soderstrom,et al.  CD laser optical data links for workstations and midrange computers , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

[2]  Tong Lu,et al.  Optical data link using a CD laser , 1992, Other Conferences.

[3]  D. S. Alles Trends in laser packaging , 1990, 40th Conference Proceedings on Electronic Components and Technology.

[4]  I. Nishi,et al.  Low-loss laser diode module using a molded aspheric glass lens , 1990, IEEE Photonics Technology Letters.