Locally delineating of junctions and defects by local cross-section electron-beam-induced-current technique
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T. Koyama | M. Umeno | K. Sonoda | J. Komori | Y. Mashiko | K. Sonoda | M. Umeno | T. Koyama | Junko Komori | Yoji Mashiko
[1] Peter Schwander,et al. TWO-DIMENSIONAL MAPPING OF THE ELECTROSTATIC POTENTIAL IN TRANSISTORS BY ELECTRON HOLOGRAPHY , 1999 .
[2] David C. Joy,et al. Introduction to electron holography , 1999 .
[3] G. Rozgonyi,et al. DRAM Wafer Qualification Issues: Oxide Integrity vs. D-Defects, Oxygen Precipitates and High Temperature Annealing , 1995 .
[4] D. Van Dyck,et al. Handbook of Microscopy , 1996 .
[5] Wilfried Vandervorst,et al. Comparison of two-dimensional carrier profiles in metal–oxide– semiconductor field-effect transistor structures obtained with scanning spreading resistance microscopy and inverse modeling , 2000 .
[6] H. Luftman,et al. Practical perspective of shallow junction analysis , 1996 .
[7] D. Maher,et al. Quantitative two‐dimensional dopant profiles obtained directly from secondary electron images , 1996 .
[8] Vladimir A. Ukraintsev,et al. Scanning capacitance spectroscopy: An analytical technique for pn-junction delineation in Si devices , 1998 .
[9] S. Luning,et al. Physical characterization of two‐dimensional doping profiles for process modeling , 1996 .