Research on the influence of machining introduced sub-surface defects and residue stress upon the mechanical properties of single crystal copper

Large scale molecular dynamics simulations of nanomachining and stretching of single crystal copper are performed to analyze the machining process’ influence on the material’s mechanical properties. The simulation results show that the machining process will introduce interfacial defects inside the specimen and enhance the compressive stress beneath the surface. Generally speaking, interfacial defects lead to the decrease of the strength limit, while residue compressive stress can enhance the elastic limit and even the strength limit. Various machining parameters are adopted to investigate their influence on the mechanical behavior of machined specimen. Lower cutting speed and smaller cutting depth lead to less defects and greater residue compressive stress, which brings about better mechanical properties. The elastic limit increases by 36.8% under the cutting depth of 0.73 nm and decreases by 21.1% under the cutting depth of 1.46 nm. The strength limit increases by 7.7% under the cutting speed of 100 m/s and decreases by 28.2% under the cutting speed of 300 m/s.

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