Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints
暂无分享,去创建一个
[1] Y. C. Chan,et al. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages , 2010 .
[2] Paul A. Lauro,et al. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders , 2008 .
[3] C. Kao,et al. Pronounced electromigration of Cu in molten Sn-based solders , 2008 .
[4] Kimihiro Yamanaka,et al. Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system , 2007, Microelectron. Reliab..
[5] Y. C. Chuang,et al. Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps , 2006 .
[6] S. W. Liang,et al. Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes , 2006 .
[7] K. N. Subramanian,et al. Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys , 2004 .
[8] Xiang Dai,et al. Reliability issues for flip-chip packages , 2004, Microelectron. Reliab..
[9] J. O. Suh,et al. Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints , 2003 .
[10] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .
[11] King-Ning Tu,et al. Physics and materials challenges for lead-free solders , 2003 .
[12] King-Ning Tu,et al. Current-crowding-induced electromigration failure in flip chip solder joints , 2002 .
[13] D. C. Yeh,et al. Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin , 1984 .
[14] King-Ning Tu,et al. Kinetics of interfacial reaction in bimetallic CuSn thin films , 1982 .
[15] F. Huang. Diffusion of Sb^ , Cd^ , Sn^ , and Zn^ in Tin , 1974 .
[16] David Turnbull,et al. Interstitial Diffusion of Copper in Tin , 1967 .
[17] B. Dyson. Diffusion of Gold and Silver in Tin Single Crystals , 1966 .
[18] A. Nowick,et al. Diffusion in solids: recent developments , 1975 .