250°C SiC high density power module development

Taking full advantage of SiC devices, a team from Oak Ridge National Laboratory, the University of Tennessee and Virginia Polytechnic Institute and State University have designed, developed, and tested a phase-leg power module based on a high temperature wirebond package. Details of the layout, gate drive, and cooling system designs are described. Continuous power tests confirmed that our design process produced a high density power module that operated successfully at high junction temperatures.

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