Area Array Technology for High Reliability Applications

[1]  Raj N. Master,et al.  Ceramic ball grid array for AMD K6 microprocessor application , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[2]  Reza Ghaffarian.  Chip Scale Package Assembly Reliability , 2001 .

[3]  R. Ghaffarian,et al.  Comparison of x-ray inspection systems for BGA/CCGA quality assurance and crack detection , 2003 .

[4]  Joseph Fjelstad,et al.  Chip scale packaging for modern electronics , 2003 .

[5]  C. Goldsmith,et al.  Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[6]  J. Jozwiak,et al.  Lead-free package interconnections for ceramic grid arrays , 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

[7]  R. Ghaffarian,et al.  Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges , 2001 .

[8]  T. Koschmieder,et al.  Underfilled BGAs for ceramic BGA packages and board-level reliability , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).