Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation

Taking the advantage of the thermo-elastic effect, while using an infrared camera system, the mechanical stress could be made visible. The stress concentrations at the tip of a subcritical crack growth could clearly be detected. Through the observation during the periodic loading of a CT-specimen the crack growth rate can be determined. For this purpose, a specially developed loading stage will be presented. It is now possible to have further investigation in material class of polymers, which is very important in the field of system integration. First promising results will be presented.

[1]  R. J. Jenkins,et al.  Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity , 1961 .

[2]  H. Reichl,et al.  Modelling guidelines and non-destructive analysis for thermal and mechanical behaviour of via-structures in organic boards , 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

[3]  Bernhard Wunderle,et al.  Lifetime modelling for microsystems integration: from nano to systems , 2009 .

[4]  Hartmut Pasternak,et al.  Thermovision ‐ Entwicklung eines neuen Verfahrens zur Dehnungsanalyse beanspruchter Stahlbauteile , 2002 .

[5]  P. Gargini,et al.  The International Technology Roadmap for Semiconductors (ITRS): "Past, present and future" , 2000, GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuits Symposium. 22nd Annual Technical Digest 2000. (Cat. No.00CH37084).

[6]  M. Biot Thermoelasticity and Irreversible Thermodynamics , 1956 .

[7]  H. Reichl,et al.  Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs , 2008, 2008 2nd Electronics System-Integration Technology Conference.

[8]  R. Schacht,et al.  Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography , 2008, 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems.

[9]  P. Stanley,et al.  Quantitative stress analysis by means of the thermoelastic effect , 1985 .

[10]  B. Michel,et al.  Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects , 2007, 2007 8th International Conference on Electronic Packaging Technology.

[11]  Joseph Gill,et al.  On the dynamical theory of heat , 1864 .

[12]  B. Wunderle,et al.  Interface Characterization and Failure Modeling for Semiconductor Packages , 2008, 2008 10th Electronics Packaging Technology Conference.

[13]  Bernhard Wunderle,et al.  Induced delamination of silicon-molding compound interfaces , 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[14]  R. Schacht,et al.  Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis , 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.