Reactive sputtering of TiOxNy coatings by the reactive gas pulsing process: Part III: The particular case of exponential pulses

[1]  D. J. Christie,et al.  Control of reactive sputtering processes , 2005 .

[2]  S. Berg,et al.  Fundamental understanding and modeling of reactive sputtering processes , 2005 .

[3]  S. Nascimento,et al.  Preparation of magnetron sputtered TiNxOy thin films , 2003 .

[4]  D. Depla,et al.  Target voltage behaviour during DC sputtering of silicon in an argon/nitrogen mixture , 2002 .

[5]  F. Lévy,et al.  Correlation between processing and properties of TiOxNy thin films sputter deposited by the reactive gas pulsing technique , 2001 .

[6]  F. Lévy,et al.  Enhanced sputtering of titanium oxide, nitride and oxynitride thin films by the reactive gas pulsing technique , 2001 .

[7]  M. H. Kazemeini,et al.  Formation of thin TiNxOy films by using a hollow cathode reactive DC sputtering system , 2000 .

[8]  I. Safi,et al.  Recent aspects concerning DC reactive magnetron sputtering of thin films: a review , 2000 .

[9]  Sören Berg,et al.  Dynamic simulations of pulsed reactive sputtering processes , 2000 .

[10]  N. Martin,et al.  Instabilities of the reactive sputtering process involving one metallic target and two reactive gases , 1999 .

[11]  R. Howson,et al.  High rate reactive sputtering using gas pulsing: a technique for the creation of films onto large, flat substrates , 1999 .

[12]  R. Howson,et al.  The properties of reactively sputtered, stoichiometry-controlled and optimum-conductivity transparent zinc/aluminium oxide films as a function of their aluminium content , 1998 .

[13]  S. Berg,et al.  Hysteresis effects in the sputtering process using two reactive gases , 1995 .

[14]  R. Mueller,et al.  Advances in partial-pressure control applied to reactive sputtering , 1989 .

[15]  W. Sproul,et al.  High rate reactive sputtering process control , 1987 .

[16]  S. Schiller,et al.  Deposition of hard wear-resistant coatings by reactive D.C. Plasmatron sputtering , 1984 .