반도체 실리콘 웨이퍼 가공용 폴리싱머신의 구조해석에 관한연구

Although Korea is now the top nation to produce non-memory semi-conductors in the world, but there are lacked informations about the researches and developments for the domestic equipments to manufacture the accurate silicon wafer such as a lapping, and polishing machine. Therefore in this study, as the consideration to develop a domestic polishing machine in the future, some trials were carried out to take some basic design data being useful to improve the structure of a specified polishing machine for silicon wafer. It was focused in plate and frame part that is base part in a polishing machine. Through its' 3D modeling, and structural analysis, the problems were investigated the deformation and stress of major parts, and the improvement methods were proposed by the results of analysis. As results, the thermal deformation in plate that contacts directly with silicon wafer was dominated, and they were known that it was very important to review the design factors to get a stability of thermal, and a structural robustness, too.