Continuous Improvement: Tools and Techniques for Reliability Improvement
暂无分享,去创建一个
[1] Salvador Mir,et al. Electrically induced stimuli for MEMS self-test , 2001, Proceedings 19th IEEE VLSI Test Symposium. VTS 2001.
[2] L.E. Felton,et al. Chip scale packaging of a MEMS accelerometer , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[3] Chung-Seog Oh,et al. Comparison of the Young’s modulus of polysilicon film by tensile testing and nanoindentation , 2005 .
[4] S. Senturia,et al. M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures , 1997 .
[5] Wen-Ben Jone,et al. MEMS Yield Simulation with Monte Carlo Method , 2007 .
[6] J. Schweitz,et al. Micromechanical fracture strength of silicon , 1990 .
[7] R. D. Blanton,et al. MEMS fault model generation using CARAMEL , 1998, Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270).
[8] Salvador Mir,et al. Failure mechanisms and fault classes for CMOS-compatible microelectromechanical systems , 1998, Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270).
[9] S.B. Brown,et al. Materials reliability in MEMS devices , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[10] James G. Bralla. Design for Excellence , 1995 .
[11] D. Profunser,et al. Determination of the material properties of microstructures by laser based ultrasound. , 2004, Ultrasonics.
[12] Serge Habraken,et al. Quantitative Accelerated Life Testing of MEMS Accelerometers , 2007, Sensors.
[13] R. Howe,et al. Microfabricated structures for the in situ measurement of residual stress, Young’s modulus, and ultimate strain of thin films , 1987 .
[14] G. Pharr,et al. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments , 1992 .
[15] R.K. Gupta,et al. Electronically probed measurements of MEMS geometries , 2000, Journal of Microelectromechanical Systems.
[16] Timothy P. Weihs,et al. Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films , 1988 .
[17] Mark G. Allen,et al. In situ measurement of mechanical properties of polyimide films using micromachined resonant string structures , 1999 .
[18] Arthur S. Morris,et al. Top-down design flow for MOEMS , 2001, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.
[19] William C. Tang,et al. Viscous air damping in laterally driven microresonators , 1994, Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems.
[20] T. Kenny,et al. What is the Young's Modulus of Silicon? , 2010, Journal of Microelectromechanical Systems.
[21] Tai-Ran Hsu,et al. Reliability in MEMS Packaging , 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.
[22] N. N. Nemeth,et al. Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials , 2003 .
[23] Khaled Elleithy,et al. Innovative Algorithms and Techniques in Automation, Industrial Electronics and Telecommunications , 2007 .
[24] Bharat Bhushan,et al. Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction , 2003 .
[25] D. W. Burns,et al. Diagnostic microstructures for the measurement of intrinsic strain in thin films , 1992 .
[26] W. Knauss,et al. A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy , 2002 .
[27] James G. Boyd,et al. Improvements in MEMS gyroscope production as a result of using in situ, aligned, current-limited anodic bonding , 2005 .
[28] W.N. Sharpe. Mechanical properties of MEMS materials , 2001, 2001 International Semiconductor Device Research Symposium. Symposium Proceedings (Cat. No.01EX497).
[29] M. R. Douglass,et al. Lifetime estimates and unique failure mechanisms of the Digital Micromirror Device (DMD) , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
[30] R. L. Edwards,et al. Comparison of tensile and bulge tests for thin-film silicon nitride , 2004 .
[31] Dan M. Frangopol,et al. Reliability-based analysis and design optimization of electrostatically actuated MEMS , 2004 .
[32] M. A. Haque,et al. In-situ tensile testing of nano-scale specimens in SEM and TEM , 2002 .
[33] G Lorenz,et al. Network-Type Modeling of Micromachined Sensor Systems , 1998 .
[34] J. Schweitz,et al. Influence of surface coatings on elasticity, residual stresses, and fracture properties of silicon microelements , 1989 .
[35] D. Teegarden,et al. How to model and simulate microgyroscope systems , 1998 .
[36] S.P. Vudathu,et al. A Design Methodology for the Yield Enhancement of MEMS Designs with Respect to Process Induced Variations , 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
[37] Gerold Schropfer,et al. Designing manufacturable MEMS in CMOS-compatible processes: methodology and case studies , 2004, SPIE Photonics Europe.
[38] S. F. Bart,et al. A Methodology and Associated CAD Tools for Support of Concurrent Design of MEMS , 1999, VLSI.
[39] K. Petersen. Dynamic micromechanics on silicon: Techniques and devices , 1978, IEEE Transactions on Electron Devices.
[40] W. Sharpe. Murray lecture tensile testing at the micrometer scale: Opportunities in experimental mechanics , 2003 .
[41] C. C. Abnet,et al. Wafer Scale Testing of MEMS Structural Films , 1999 .
[42] M. Madou. Fundamentals of microfabrication , 1997 .
[43] T. B. Parson,et al. Accelerating aging failures in MEMS devices , 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..
[44] C. Mastrangelo,et al. A simple experimental technique for the measurement of the work of adhesion of microstructures , 1992, Technical Digest IEEE Solid-State Sensor and Actuator Workshop.
[45] Alain Vachoux,et al. VHDL–1076.1 modeling examples for microsystem simulation , 1997 .
[46] William D. Nix,et al. Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films , 1992 .
[47] R. D. Blanton,et al. High-Level Fault Modeling in Surface-Micromachined MEMS , 2001 .
[48] Horacio Dante Espinosa,et al. A methodology for determining mechanical properties of freestanding thin films and MEMS materials , 2003 .
[49] Joost J. Vlassak,et al. A new bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin films , 1992 .
[50] Geoff Tennant,et al. Six Sigma : SPC and TQM in Manufacturing and Services , 2001 .
[51] P. McHugh,et al. A review of deformation and fatigue of metals at small size scales , 2005 .
[52] Marcelo Lubaszewski,et al. Microsystems testing: an approach and open problems , 1998, Proceedings Design, Automation and Test in Europe.
[53] Robert Puers,et al. A low frequency electrical test set-up for the reliability assessment of capacitive RF MEMS switches , 2003 .
[54] Stephen F. Bart,et al. Coupled package-device modeling for microelectromechanical systems , 2000 .
[55] Dhiraj K. Pradhan,et al. Integrated Circuit Manufacturability: The Art of Process and Design Integration , 1998 .
[56] William D. Nix,et al. Mechanical properties of thin films , 1989 .
[57] S. Senturia. Microsystem Design , 2000 .
[58] K. Lian,et al. Tensile, creep and fatigue properties of LIGA nickel structures , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).
[59] Xin Zhang,et al. Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor–Package Interaction Simulations , 2007, Journal of Microelectromechanical Systems.
[60] William D. Nix,et al. Effects of the substrate on the determination of thin film mechanical properties by nanoindentation , 2002 .
[61] Siebe Bouwstra,et al. Critical comparison of metrology techniques for MEMS , 2007, SPIE MOEMS-MEMS.
[62] S.P. Vudathu,et al. A Critical Enhancement in the Yield Analysis of Microsystems , 2007, 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual.
[63] D. Schroder. Semiconductor Material and Device Characterization , 1990 .
[64] Yong Zhou,et al. The evaluation of Young's modulus and residual stress of copper films by microbridge testing , 2006 .