Mutual ballasting: A novel technique for improved inductive system level IEC ESD stress performance for automotive applications

A new ESD failure mode under inductive IEC stress of automotive CAN pins is identified. Inductor saturation causes increase of the rise-time from ins to ~20ns, leading to non-uniform conduction in the bidirectional ESD circuit. A new mutual ballasting layout technique is introduced to recover the system level ESD performance.

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