Reject frame discrimination system by a z-level and method of a wire bonding using the same

The wire-bonding and die-attach device and a method of using a reject frame determination system according to the level of the jet is started. Using a reject frame determination system of the jet-level wire bonding and die-attach device is a frame from the jet axis, and control the jet-axis movement, and the reference position capable of up-down movement to the top of the frames from the reference position on the frames of the printed circuit board be provided by the host controller to determine the top of the jet axis is the distance whether the jet axis controller for measuring the level of the jet and the jet measured from the level reject frame until the touch. If depend on the wire-bonding and die-attach device and method according to the present invention, the jet level as compared to the reference level can be determined, the reject frame dynamically determined by whether or not there is a semiconductor chip is attached to a lower error for, the reject frame it is possible to increase the proportion of automatically skip value to the wire bonding and die attach.