Influence of intermetallic compounds on the electrical resistivity of architectured copper clad aluminum composites elaborated by a restacking drawing method

Abstract Architectured wires containing 61 restacked Copper Clad Aluminum (CCA) wires were cold-drawn down to a diameter of 1 mm without intermediate annealing. Samples were taken at intermediate diameters of 3 mm and 1.7 mm to observe the wire structure at different steps. Independently of the wire diameter, the structure did not exhibit any porosity and initial CCA wires were uniformly distributed inside the structure with constant equivalent diameters. Post-elaboration annealing treatments performed on CCA and architectured wires led to the formation of Al2Cu, AlCu and Al4Cu9 intermetallic compounds (IMC). It was shown that IMC growth kinetics do not depend on the wire diameter, indicating no marked influence of the plastic deformation. The volume fraction of IMC strongly increased with the reduction of the diameter and impacted the electrical resistivity of the architectured wire. The equivalent resistivity has been easily computed by a linear rule of mixture model, with three electrical resistances in parallel (Al, Cu and IMC), weighted by their respective volume fraction. This model allowed extracting a mean resistivity of IMCs of 4.5 μΩ·cm. It also demonstrated that this restacking drawing process, without any intermediate annealing treatment is an interesting method for the elaboration of architectured wires with optimized functional properties.

[1]  A. Deschamps,et al.  Architectured duplex stainless steels micro-composite: Elaboration and microstructure characterization , 2018 .

[2]  Z. Jian,et al.  Formation and growth of Cu–Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites , 2016 .

[3]  Z. Zhang,et al.  Effects of annealing treatment on the microstructure evolution and the strength degradation behavior of the commercially pure Al conductor , 2017 .

[4]  T. Lowe,et al.  Deformation behavior of multilayered Al–Cu clad composite during cold-swaging , 2016 .

[5]  M. Sarcar,et al.  Fabrication and characterization of aluminium–copper composites , 2009 .

[6]  E. Hug,et al.  Secondary creep stage behavior of copper-clad aluminum thin wires submitted to a moderate temperature level , 2018 .

[7]  R. Pippan,et al.  Nanostructure and properties of a Cu–Cr composite processed by severe plastic deformation , 2008, 0804.4378.

[8]  E. Popova,et al.  Effect of deformation and annealing on texture parameters of composite Cu¿Nb wire , 2004 .

[9]  Hyung-ki Park,et al.  Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics , 2004 .

[10]  M. R. Toroghinejad,et al.  Investigation of nanostructured aluminum/copper composite produced by accumulative roll bonding and folding process , 2013 .

[11]  Jordi-Roger Riba,et al.  Analysis of formulas to calculate the AC resistance of different conductors' configurations , 2015 .

[12]  X. Sauvage,et al.  Solid state amorphization in cold drawn Cu/Nb wires , 2001 .

[13]  F. Fickett.  Aluminum—1. A review of resistive mechanisms in aluminum , 1971 .

[14]  O. Bouaziz,et al.  Low weight steel-magnesium composites achieved by powder compaction , 2016 .

[15]  T. Saeid,et al.  Microstructural and mechanical properties of friction stir welded aluminum/copper lap joints , 2008 .

[16]  Liu Chengqi,et al.  Microstructure evolution and strengthening mechanisms of cold-drawn commercially pure aluminum wire , 2015 .

[17]  Yong Bae Kim,et al.  Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material , 2012 .

[18]  A. Pelton,et al.  Microstructural analysis of in-situ Cu−Nb composite wires , 1987 .

[19]  E. Hug,et al.  Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires , 2011 .

[20]  Lei Lu,et al.  Ultrahigh Strength and High Electrical Conductivity in Copper , 2004, Science.

[21]  Seung-Boo Jung,et al.  Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing , 2005 .

[22]  P. Pareige,et al.  Nanostructured multifilamentary carbon-copper composites: fabrication, microstructural characterization, and properties , 2012 .

[23]  C. Bauer,et al.  Low temperature resistivity of thin film and bulk samples of CuAl2 and Cu9Al4 , 1981 .

[24]  A. Taheri,et al.  GROWTH RATE OF INTERMETALLIC COMPOUNDS IN AL/CU BIMETAL PRODUCED BY COLD ROLL WELDING PROCESS , 2001 .

[25]  Z. Fan,et al.  Effects of zinc coating on interfacial microstructures and mechanical properties of aluminum/steel bimetallic composites , 2016 .

[26]  E. Hug,et al.  Study of the intermetallic growth in copper-clad aluminum wires after thermal aging , 2014 .

[27]  A. Lassnig,et al.  Role of intermetallics on the mechanical fatigue behavior of Cu–Al ball bond interfaces , 2015 .

[28]  R. Morris,et al.  Formation of ultra-fine copper grains in copper-clad aluminum wire , 2010 .

[29]  Z. Fan,et al.  Improved steel/aluminum bonding in bimetallic castings by a compound casting process , 2015 .

[30]  Ke Han,et al.  Hardness, electrical resistivity, and modeling of in situ Cu–Nb microcomposites , 2014 .

[31]  J. Eckert,et al.  Processing of Intermetallic Titanium Aluminide Wires , 2013 .

[32]  Shuangquan Shao,et al.  Experimental research on applying the copper-clad aluminum tube as connecting tubes of air conditioners , 2015 .

[33]  A. Medvedev,et al.  Optimisation of interface formation by shear inclination: Example of aluminium-copper hybrid produced by ECAP with back-pressure , 2018 .

[34]  A. Russell,et al.  The microstructure-strength relationship in a deformation processed Al–Ca composite , 2013 .

[35]  G. Sundararajan,et al.  Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition , 2015 .

[36]  E. Gibson,et al.  The resistivity and microstructure of heavily drawn Cu‐Nb alloys , 1989 .

[37]  R. Pippan,et al.  Nanoscaled structure of a Cu–Fe composite processed by high-pressure torsion , 2005 .

[38]  M. Chen,et al.  Nanocrystalline grain structures developed in commercial purity Cu by low-temperature cold rolling , 2002 .

[39]  G. Qiao,et al.  Microstructure and tensile behavior of Cu–Al multi-layered composites prepared by plasma activated sintering , 2010 .

[40]  Z. Fan,et al.  Effect of heat treatment on bonding strength of aluminum/steel bimetal produced by a compound casting , 2018, Journal of Materials Processing Technology.

[41]  Ping Wang,et al.  Microstructural development and its effects on mechanical properties of Al/Cu laminated composite , 2015 .

[42]  W. Głuchowski,et al.  Microstructure and properties of Cu–Nb and Cu–Ag nanofiber composites , 2015 .

[43]  C. Bauer,et al.  Investigation of interfacial reactions in thin film couples of aluminum and copper by measurement of low temperature contact resistance , 1980 .

[44]  M. Šofer,et al.  Improvement of mechanical and electrical properties of rotary swaged Al-Cu clad composites , 2017 .

[45]  Z. Rdzawski,et al.  Microstructure and Properties of Multifibre Composites , 2016 .

[46]  A. Russell,et al.  Modeling the electrical resistivity of deformation processed metal–metal composites , 2014 .

[47]  S. Hong,et al.  Effect of heat treatment on tensile deformation characteristics and properties of Al3003/STS439 clad composite , 2014 .

[48]  James P. Harbison,et al.  Anomalous increase in strength of in situ formed Cu‐Nb multifilamentary composites , 1978 .

[49]  T. Xi,et al.  Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling , 2011 .

[50]  Trevor M. Benson,et al.  A simple formula for calculating the frequency‐dependent resistance of a round wire , 1998 .

[51]  H. D. Manesh,et al.  The effect of annealing treatment on mechanical properties of aluminum clad steel sheet , 2003 .

[52]  F. J. Humphreys,et al.  Recrystallization and Related Annealing Phenomena , 1995 .