Self Current Limiting MgO ReRAM Devices for Low-Power Non-Volatile Memory Applications

We report an interface engineering approach to achieve a self-compliance controlled and forming-free switching in ReRAM devices based on MgO switching layers. The proposed devices showed scalability in self-compliance current with low set and reset voltages as the interfacial layer thickness was increased. The devices showed write endurance up to 1000 cycles under self-compliance controlled switching and demonstrated potential for ultra-fast switching with low switching energies. The mechanism behind self-compliant switching is explained and supported with capacitance-voltage measurement. We believe that these devices will not require compliance current limiting transistors which will allow massive densification of these devices.

[1]  Saptarshi Mandal,et al.  Switching dynamics and charge transport studies of resistive random access memory devices , 2012 .

[2]  Zhiping Yu,et al.  Resistive Switching Performance Improvement of ${\rm Ta}_{2}{\rm O}_{5-x}/{\rm TaO}_{y}$ Bilayer ReRAM Devices by Inserting ${\rm AlO}_{\delta}$ Barrier Layer , 2014, IEEE Electron Device Letters.

[3]  C. Chung,et al.  A non-linear ReRAM cell with sub-1μA ultralow operating current for high density vertical resistive memory (VRRAM) , 2012, 2012 International Electron Devices Meeting.

[4]  M. Tsai,et al.  Robust High-Resistance State and Improved Endurance of $\hbox{HfO}_{X}$ Resistive Memory by Suppression of Current Overshoot , 2011, IEEE Electron Device Letters.

[5]  M. Rozenberg,et al.  Mechanism for bipolar resistive switching in transition-metal oxides , 2010, 1001.0703.

[6]  Ken Takeuchi,et al.  x11 performance increase, x6.9 endurance enhancement, 93% energy reduction of 3D TSV-integrated hybrid ReRAM/MLC NAND SSDs by data fragmentation suppression , 2012, 2012 Symposium on VLSI Circuits (VLSIC).

[7]  Y. Shih,et al.  A forming-free WOx resistive memory using a novel self-aligned field enhancement feature with excellent reliability and scalability , 2010, 2010 International Electron Devices Meeting.

[8]  Hangbing Lv,et al.  Effect of low constant current stress treatment on the performance of the Cu/ZrO2/Pt resistive switching device , 2012 .

[9]  Young-soo Park,et al.  Low‐Temperature‐Grown Transition Metal Oxide Based Storage Materials and Oxide Transistors for High‐Density Non‐volatile Memory , 2009 .

[10]  Kinam Kim,et al.  A fast, high-endurance and scalable non-volatile memory device made from asymmetric Ta2O(5-x)/TaO(2-x) bilayer structures. , 2011, Nature materials.

[11]  Shimeng Yu,et al.  Conduction mechanism of TiN/HfOx/Pt resistive switching memory: A trap-assisted-tunneling model , 2011 .

[12]  Pascal Normand,et al.  Forming-free resistive switching memories based on titanium-oxide nanoparticles fabricated at room temperature , 2013 .

[13]  Z. Wei,et al.  Highly reliable TaOx ReRAM and direct evidence of redox reaction mechanism , 2008, 2008 IEEE International Electron Devices Meeting.

[14]  Frederick T. Chen,et al.  Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM , 2008, 2008 IEEE International Electron Devices Meeting.

[15]  Zheng Fang,et al.  Endurance Degradation in Metal Oxide-Based Resistive Memory Induced by Oxygen Ion Loss Effect , 2013, IEEE Electron Device Letters.

[16]  A. Sawa Resistive switching in transition metal oxides , 2008 .

[17]  S. O. Park,et al.  Highly scalable nonvolatile resistive memory using simple binary oxide driven by asymmetric unipolar voltage pulses , 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

[18]  Wenchao Lu,et al.  Switching characteristics of W/Zr/HfO2/TiN ReRAM devices for multi-level cell non-volatile memory applications , 2015 .

[19]  D. Gilmer,et al.  Effects of RRAM Stack Configuration on Forming Voltage and Current Overshoot , 2011, 2011 3rd IEEE International Memory Workshop (IMW).

[20]  K. Shimakawa,et al.  Fast switching and long retention Fe-O ReRAM and its switching mechanism , 2007, 2007 IEEE International Electron Devices Meeting.

[21]  Hangbing Lv,et al.  Nitrogen-induced improvement of resistive switching uniformity in a HfO2-based RRAM device , 2012 .

[22]  S. Rhee,et al.  Effect of the top electrode material on the resistive switching of TiO2 thin film , 2010 .

[23]  Yibo Li,et al.  Switching Characteristics of $\hbox{Ru/HfO}_{2} \hbox{/TiO}_{2-x}\hbox{/Ru}$ RRAM Devices for Digital and Analog Nonvolatile Memory Applications , 2012, IEEE Electron Device Letters.

[24]  Heon-Ju Lee,et al.  Effect of the top electrode materials on the resistive switching characteristics of TiO2 thin film , 2011 .

[25]  G. Reimbold,et al.  Accurate analysis of parasitic current overshoot during forming operation in RRAMs , 2011 .

[26]  Wenchao Lu,et al.  ReRAM device performance study with Transition Metal Disulfide interfacial layer , 2014, 72nd Device Research Conference.

[27]  P. Zhou,et al.  In Situ Observation of Compliance-Current Overshoot and Its Effect on Resistive Switching , 2010, IEEE Electron Device Letters.

[28]  Shimeng Yu,et al.  Understanding metal oxide RRAM current overshoot and reliability using Kinetic Monte Carlo simulation , 2012, 2012 International Electron Devices Meeting.

[29]  Byung Joon Choi,et al.  Purely Electronic Switching with High Uniformity, Resistance Tunability, and Good Retention in Pt‐Dispersed SiO2 Thin Films for ReRAM , 2011, Advanced materials.

[30]  Hyunsang Hwang,et al.  Self-Selective Characteristics of Nanoscale $ \hbox{VO}_{x}$ Devices for High-Density ReRAM Applications , 2012, IEEE Electron Device Letters.

[31]  Hisashi Shima,et al.  Resistive Random Access Memory (ReRAM) Based on Metal Oxides , 2010, Proceedings of the IEEE.

[32]  Wenchao Lu,et al.  A hardware-based approach for implementing biological visual cortex-inspired image learning and recognition , 2014, 2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS).

[33]  W. J. Liu,et al.  Highly Uniform, Self-Compliance, and Forming-Free ALD $\hbox{HfO}_{2}$ -Based RRAM With Ge Doping , 2012, IEEE Transactions on Electron Devices.

[34]  Xin Peng Wang,et al.  Optimized Ni Oxidation in 80-nm Contact Holes for Integration of Forming-Free and Low-Power Ni/NiO/Ni Memory Cells , 2009, IEEE Transactions on Electron Devices.

[35]  An Chen,et al.  Current overshoot during set and reset operations of resistive switching memories , 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

[36]  Wen-Chieh Shih,et al.  Nonpolar resistive switching in the Pt/MgO/Pt nonvolatile memory device , 2010 .

[37]  U-In Chung,et al.  Highly Uniform Switching of Tantalum Embedded Amorphous Oxide Using Self-Compliance Bipolar Resistive Switching , 2011, IEEE Electron Device Letters.

[38]  Zhiping Yu,et al.  Stable self-compliance resistive switching in AlOδ/Ta2O(5-x)/TaOy triple layer devices. , 2015, Nanotechnology.

[39]  S. Maikap,et al.  Self-compliance RRAM characteristics using a novel W/TaO x /TiN structure , 2014, Nanoscale Research Letters.

[40]  Wenchao Lu,et al.  Switching characteristics of MgO based self-compliant ReRAM devices , 2015, 2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS).

[41]  S. J. Kim,et al.  Low power operating bipolar TMO ReRAM for sub 10 nm era , 2010, 2010 International Electron Devices Meeting.

[42]  Z. Wei,et al.  Demonstration of high-density ReRAM ensuring 10-year retention at 85°C based on a newly developed reliability model , 2011, 2011 International Electron Devices Meeting.

[43]  Jiang Yin,et al.  Conduction mechanism of resistance switching in fully transparent MgO-based memory devices , 2013 .

[44]  Shimeng Yu,et al.  Metal–Oxide RRAM , 2012, Proceedings of the IEEE.

[45]  Jun Young Byun,et al.  Characteristics and the Model of Resistive Random Access Memory Switching of the Ti/TiO2 Resistive Material Depending on the Thickness of Ti , 2011 .