Self Current Limiting MgO ReRAM Devices for Low-Power Non-Volatile Memory Applications
暂无分享,去创建一个
Yibo Li | Wenchao Lu | Rashmi Jha | Wenbo Chen | R. Jha | Wenchao Lu | Yibo Li | Wenbo Chen
[1] Saptarshi Mandal,et al. Switching dynamics and charge transport studies of resistive random access memory devices , 2012 .
[2] Zhiping Yu,et al. Resistive Switching Performance Improvement of ${\rm Ta}_{2}{\rm O}_{5-x}/{\rm TaO}_{y}$ Bilayer ReRAM Devices by Inserting ${\rm AlO}_{\delta}$ Barrier Layer , 2014, IEEE Electron Device Letters.
[3] C. Chung,et al. A non-linear ReRAM cell with sub-1μA ultralow operating current for high density vertical resistive memory (VRRAM) , 2012, 2012 International Electron Devices Meeting.
[4] M. Tsai,et al. Robust High-Resistance State and Improved Endurance of $\hbox{HfO}_{X}$ Resistive Memory by Suppression of Current Overshoot , 2011, IEEE Electron Device Letters.
[5] M. Rozenberg,et al. Mechanism for bipolar resistive switching in transition-metal oxides , 2010, 1001.0703.
[6] Ken Takeuchi,et al. x11 performance increase, x6.9 endurance enhancement, 93% energy reduction of 3D TSV-integrated hybrid ReRAM/MLC NAND SSDs by data fragmentation suppression , 2012, 2012 Symposium on VLSI Circuits (VLSIC).
[7] Y. Shih,et al. A forming-free WOx resistive memory using a novel self-aligned field enhancement feature with excellent reliability and scalability , 2010, 2010 International Electron Devices Meeting.
[8] Hangbing Lv,et al. Effect of low constant current stress treatment on the performance of the Cu/ZrO2/Pt resistive switching device , 2012 .
[9] Young-soo Park,et al. Low‐Temperature‐Grown Transition Metal Oxide Based Storage Materials and Oxide Transistors for High‐Density Non‐volatile Memory , 2009 .
[10] Kinam Kim,et al. A fast, high-endurance and scalable non-volatile memory device made from asymmetric Ta2O(5-x)/TaO(2-x) bilayer structures. , 2011, Nature materials.
[11] Shimeng Yu,et al. Conduction mechanism of TiN/HfOx/Pt resistive switching memory: A trap-assisted-tunneling model , 2011 .
[12] Pascal Normand,et al. Forming-free resistive switching memories based on titanium-oxide nanoparticles fabricated at room temperature , 2013 .
[13] Z. Wei,et al. Highly reliable TaOx ReRAM and direct evidence of redox reaction mechanism , 2008, 2008 IEEE International Electron Devices Meeting.
[14] Frederick T. Chen,et al. Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM , 2008, 2008 IEEE International Electron Devices Meeting.
[15] Zheng Fang,et al. Endurance Degradation in Metal Oxide-Based Resistive Memory Induced by Oxygen Ion Loss Effect , 2013, IEEE Electron Device Letters.
[16] A. Sawa. Resistive switching in transition metal oxides , 2008 .
[17] S. O. Park,et al. Highly scalable nonvolatile resistive memory using simple binary oxide driven by asymmetric unipolar voltage pulses , 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..
[18] Wenchao Lu,et al. Switching characteristics of W/Zr/HfO2/TiN ReRAM devices for multi-level cell non-volatile memory applications , 2015 .
[19] D. Gilmer,et al. Effects of RRAM Stack Configuration on Forming Voltage and Current Overshoot , 2011, 2011 3rd IEEE International Memory Workshop (IMW).
[20] K. Shimakawa,et al. Fast switching and long retention Fe-O ReRAM and its switching mechanism , 2007, 2007 IEEE International Electron Devices Meeting.
[21] Hangbing Lv,et al. Nitrogen-induced improvement of resistive switching uniformity in a HfO2-based RRAM device , 2012 .
[22] S. Rhee,et al. Effect of the top electrode material on the resistive switching of TiO2 thin film , 2010 .
[23] Yibo Li,et al. Switching Characteristics of $\hbox{Ru/HfO}_{2} \hbox{/TiO}_{2-x}\hbox{/Ru}$ RRAM Devices for Digital and Analog Nonvolatile Memory Applications , 2012, IEEE Electron Device Letters.
[24] Heon-Ju Lee,et al. Effect of the top electrode materials on the resistive switching characteristics of TiO2 thin film , 2011 .
[25] G. Reimbold,et al. Accurate analysis of parasitic current overshoot during forming operation in RRAMs , 2011 .
[26] Wenchao Lu,et al. ReRAM device performance study with Transition Metal Disulfide interfacial layer , 2014, 72nd Device Research Conference.
[27] P. Zhou,et al. In Situ Observation of Compliance-Current Overshoot and Its Effect on Resistive Switching , 2010, IEEE Electron Device Letters.
[28] Shimeng Yu,et al. Understanding metal oxide RRAM current overshoot and reliability using Kinetic Monte Carlo simulation , 2012, 2012 International Electron Devices Meeting.
[29] Byung Joon Choi,et al. Purely Electronic Switching with High Uniformity, Resistance Tunability, and Good Retention in Pt‐Dispersed SiO2 Thin Films for ReRAM , 2011, Advanced materials.
[30] Hyunsang Hwang,et al. Self-Selective Characteristics of Nanoscale $ \hbox{VO}_{x}$ Devices for High-Density ReRAM Applications , 2012, IEEE Electron Device Letters.
[31] Hisashi Shima,et al. Resistive Random Access Memory (ReRAM) Based on Metal Oxides , 2010, Proceedings of the IEEE.
[32] Wenchao Lu,et al. A hardware-based approach for implementing biological visual cortex-inspired image learning and recognition , 2014, 2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS).
[33] W. J. Liu,et al. Highly Uniform, Self-Compliance, and Forming-Free ALD $\hbox{HfO}_{2}$ -Based RRAM With Ge Doping , 2012, IEEE Transactions on Electron Devices.
[34] Xin Peng Wang,et al. Optimized Ni Oxidation in 80-nm Contact Holes for Integration of Forming-Free and Low-Power Ni/NiO/Ni Memory Cells , 2009, IEEE Transactions on Electron Devices.
[35] An Chen,et al. Current overshoot during set and reset operations of resistive switching memories , 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).
[36] Wen-Chieh Shih,et al. Nonpolar resistive switching in the Pt/MgO/Pt nonvolatile memory device , 2010 .
[37] U-In Chung,et al. Highly Uniform Switching of Tantalum Embedded Amorphous Oxide Using Self-Compliance Bipolar Resistive Switching , 2011, IEEE Electron Device Letters.
[38] Zhiping Yu,et al. Stable self-compliance resistive switching in AlOδ/Ta2O(5-x)/TaOy triple layer devices. , 2015, Nanotechnology.
[39] S. Maikap,et al. Self-compliance RRAM characteristics using a novel W/TaO x /TiN structure , 2014, Nanoscale Research Letters.
[40] Wenchao Lu,et al. Switching characteristics of MgO based self-compliant ReRAM devices , 2015, 2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS).
[41] S. J. Kim,et al. Low power operating bipolar TMO ReRAM for sub 10 nm era , 2010, 2010 International Electron Devices Meeting.
[42] Z. Wei,et al. Demonstration of high-density ReRAM ensuring 10-year retention at 85°C based on a newly developed reliability model , 2011, 2011 International Electron Devices Meeting.
[43] Jiang Yin,et al. Conduction mechanism of resistance switching in fully transparent MgO-based memory devices , 2013 .
[44] Shimeng Yu,et al. Metal–Oxide RRAM , 2012, Proceedings of the IEEE.
[45] Jun Young Byun,et al. Characteristics and the Model of Resistive Random Access Memory Switching of the Ti/TiO2 Resistive Material Depending on the Thickness of Ti , 2011 .