The suitability of a snap-curable acrylic-based conductive adhesive as a low-stress interconnection for thin solar cells was studied. Modules were manufactured using the conductive adhesive with industrial thin crystalline silicon solar cells. The best results were obtained for an adhesive with a high silver filler content. The adhesive resulted in a similar peel strength to a soldered interconnection. Although the contact resistance of the adhesive is much higher than for solder, it does not affect the module output power. Degradation in fill factor of only 2 % was measured after 1000 thermal shock cycles while no degradation was observed at all after 1000 hours damp-heat. Further testing on full-size modules to prove the suitability of the conductive adhesive in outdoor use is ongoing. Climate chamber test results of a direct comparison with soldered modules are presented.