Basic RF Characteristics of the Microstrip Line Employing Periodically Perforated Ground Metal and Its Application to Highly Miniaturized On-Chip Passive Components on GaAs MMIC

In this study, highly miniaturized on-chip impedance transformers employing periodically perforated ground metal (PPGM) were developed for application to broadband low-impedance matching. In order to realize a broadband operation by using an equal ripple transfer characteristic over a passband, a three-section transformer was designed by mapping its reflection coefficient to the Chebyshev function. The three-section transformer showed a good RF performance over a broadband (1.5-13 GHz) including ultra-wideband. The size of the three-section transformer was 0.129 mm2, which is 2.3% of the size of the transformer fabricated by a conventional microstrip line. Using the PPGM structure, a highly miniaturized on-chip Wilkinson power divider with a low port impedance of 13 Omega was also developed, and its size is 0.11 mm2, which is 6% of the size of the one fabricated by the conventional microstrip line. In addition, in this study, the PPGM structure was theoretically characterized using a conventional capacitive loaded periodic structure. Using the theoretical analysis, basic characteristics of the transmission line with PPGM were also investigated in order to evaluate its suitability for application to a development of miniaturized on-chip passive components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip components on monolithic microwave integrated circuits

[1]  Jae-Bong Lim,et al.  A novel 1-D periodic defected ground structure for planar circuits , 2000 .

[2]  Y. Qian,et al.  A design of the low-pass filter using the novel microstrip defected ground structure , 2001 .

[3]  K. Matsunaga,et al.  A CW 4-W Ka-band power amplifier utilizing MMIC multichip technology , 2000, IEEE Journal of Solid-State Circuits.

[4]  Young Yun,et al.  A fully-integrated broadband amplifier MMIC employing a novel chip size package , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[5]  S. B. Cohn,et al.  Optimum Design of Stepped Transmission-Line Transformers , 1955 .

[6]  Tatsuo Itoh,et al.  A uniplanar compact photonic-bandgap (UC-PBG) structure and its applications for microwave circuit , 1999 .

[7]  T. Tanaka,et al.  A fully-integrated broadband amplifier MMIC employing a novel chip size package , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[8]  D. Pozar.  Microwave Engineering , 1990 .

[9]  Young Yun,et al.  A High Performance Downconverter MMIC for DBS Applications , 2001 .

[10]  D. G. Haigh,et al.  Low-distortion MMIC power amplifier using a new form of derivative superposition , 2001 .

[11]  Lei Zhu,et al.  Per-unit-length parameters of 1-D CPW metamaterials with simultaneously series-C and shunt-L loading , 2005, 2005 Asia-Pacific Microwave Conference Proceedings.

[12]  Andrey S. Andrenko,et al.  Application of PBG microstrip circuits for enhancing the performance of high‐density substrate patch antennas , 2002 .

[13]  Y. Yun.  A low impedance and short-guided wavelength microstrip line employing a periodically perforated ground metal and its application to miniaturized and low impedance ratrace on GaAs MMIC , 2004, 34th European Microwave Conference, 2004..

[14]  Y. Yun,et al.  Highly miniaturized on-chip passive components fabricated by microstrip lines with periodically perforated ground metal on GaAs MMIC , 2005, 2005 Asia-Pacific Microwave Conference Proceedings.

[15]  Yasushi Itoh,et al.  MMIC/Super-MIC/MIC-Combined C- to Ku-Band 2W Balanced AMplifier Multi-Chip Module , 1997 .

[16]  T. Itoh,et al.  Microwave composite right/left-handed metamaterials and devices , 2005, 2005 Asia-Pacific Microwave Conference Proceedings.