Passive compensation for high performance inter-chip communication
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[1] Eric D. Perfecto,et al. Thin-film multichip module packages for high-end IBM servers , 1998, IBM J. Res. Dev..
[2] A. Hajimiri,et al. Nonlinear transmission lines for pulse shaping in silicon , 2005, IEEE Journal of Solid-State Circuits.
[3] Haikun Zhu. High -performance low -power VLSI design , 2007 .
[4] Kaustav Banerjee,et al. Analysis and optimization of thermal issues in high-performance VLSI , 2001, ISPD '01.
[5] A. Hajimiri,et al. Nonlinear transmission lines for pulse shaping in silicon , 2005, IEEE Journal of Solid-State Circuits.
[6] William J. Dally,et al. High-performance electrical signaling , 1998, Proceedings. Fifth International Conference on Massively Parallel Processing (Cat. No.98EX182).
[7] Masanori Hashimoto,et al. Design guideline for resistive termination of on-chip high-speed interconnects , 2005, Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005..
[8] Ali Hajimiri,et al. Integrated transversal equalizers in high-speed fiber-optic systems , 2003, IEEE J. Solid State Circuits.
[9] Rui Shi,et al. Surfliner: a distortionless electrical signaling scheme for speed of light on-chip communications , 2005, 2005 International Conference on Computer Design.
[10] Howard W. Johnson,et al. High Speed Signal Propagation: Advanced Black Magic , 2003 .