A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots

Narrow slots are often employed in printed circuit board and electronic package designs to isolate the power noise coupling. In this paper, an equivalent circuit method is proposed to analyze the power and signal integrity of gapped power-ground (PG) planes. With this method, the whole gapped PG planes are divided into two regions: one is a parallel-plane structure, and another is a slot structure. An integral-equation equivalent circuit method is used to model the arbitrarily shaped parallel-plane structure. Meanwhile, the transmission-line method is used to model the slot structure. Finally, the whole modeling of gapped PG planes can be obtained by integrating the aforementioned two equivalent networks. Numerical examples reveal that this circuit approach is efficient and accurate, in comparing with the available methods.

[1]  K. Gupta,et al.  Microstrip Lines and Slotlines , 1979 .

[2]  Martin H. Graham,et al.  Book Review: High-Speed Digital Design: A Handbook of Black Magic by Howard W. Johnson and Martin Graham: (Prentice-Hall, 1993) , 1993, CARN.

[3]  Takanori Okoshi Planar Circuits for Microwaves and Lightwaves , 1985 .

[4]  Michael B. Steer,et al.  Foundations of Interconnect & Microstrip Design - 3rd Edition , 2000 .

[5]  En-Xiao Liu,et al.  A coupled efficient and systematic full-wave time-domain macromodeling and circuit Simulation method for signal integrity analysis of high-speed interconnects , 2004 .

[6]  Barry Kent Gilbert,et al.  High-frequency characterization of power/ground-plane structures , 1999 .

[7]  Joungho Kim,et al.  Hybrid analytical modeling method for split power bus in multilayered package , 2006, IEEE Transactions on Electromagnetic Compatibility.

[8]  M. B. Steer,et al.  Foundations of Interconnect and Microstrip Design: Edwards/Foundations of Interconnect and Microstrip Design , 2000 .

[9]  M. Swaminathan,et al.  Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes , 2007, IEEE Transactions on Electromagnetic Compatibility.

[10]  Madhavan Swaminathan,et al.  Modeling of multilayered power distribution planes using transmission matrix method , 2002 .

[11]  K. Srinivasan,et al.  Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors , 2008, IEEE Transactions on Advanced Packaging.

[12]  Juan Chen,et al.  Power bus isolation using power islands in printed circuit boards , 2002 .

[13]  R. Vahldieck,et al.  Efficient Simulation of Power Distribution Network by Using Integral-Equation and Modal-Decoupling Technology , 2008, IEEE Transactions on Microwave Theory and Techniques.

[14]  Madhavan Swaminathan,et al.  Modeling of irregular shaped power distribution planes using transmission matrix method , 2001 .

[15]  A. Ruehli,et al.  Circuit models for three-dimensional geometries including dielectrics , 1992 .

[16]  J.L. Drewniak,et al.  SPICE-Compatible Cavity and Transmission Line Model for Power Bus with Narrow Slots , 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

[17]  Y. Toyota,et al.  Modeling of gapped power bus structures for isolation using cavity modes and segmentation , 2003, IEEE Transactions on Electromagnetic Compatibility.