The design of a microelectromechanical systems (MEMS) socket system to enable the temporary high density interconnection of a CMOS die to a System-on-Chip (SoC) implementation of a tester is described. Connectivity is achieved with a fixed MEMS socket that is thermosonically bonded to a CMOS tester die and a carrier MEMS socket that acts as a custom die-specific removable insert for the fixed socket to easily interface the die being tested to the SoC based tester. A new cantilevered bridge-type microspring contact provides direct connectivity to the I/O pads of the die under test. The bridge-type contact spring geometry has excellent elastic properties and features a contact resistance of 19.3 m/spl Omega/ at a contact force of 1.35 mN. The MEMS socket system was designed and simulated using IntelliSuite CAD tools and fabrication arrangements are being pursued.
[1]
Y. M. Tan,et al.
Gold to gold thermosonic flip-chip bonding
,
2001
.
[2]
R. Budynas,et al.
Advanced Strength and Applied Stress Analysis
,
1977
.
[3]
Bernie Riemer,et al.
Empirical model of effects of pressure and temperature on electrical contact resistance of metals
,
2001
.
[4]
Q. Qiao,et al.
Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect
,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
[5]
S. Timoshenko,et al.
THEORY OF PLATES AND SHELLS
,
1959
.