3D LED and IC wafer level packaging

Purpose – The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages.Design/methodology/approach – These packages consist of the multi‐LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed.Findings – The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor.Originality/value – A thermal management system for 3D IC and LEDs integration packages is proposed.

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