Evolution of stresses in passivated and unpassivated metal interconnects

[1]  E. Arzt,et al.  Investigation of the stresses in continuous thin films and patterned lines by x‐ray diffraction , 1994 .

[2]  Subra Suresh,et al.  Thermal cycling and stress relaxation response of Si-Al and Si-Al-SiO2 layered thin films , 1995 .

[3]  R. Mohan,et al.  Crystal plasticity simulations of thermal stresses in thin‐film aluminum interconnects , 1995 .

[4]  P. Flinn,et al.  A new x‐ray diffractometer design for thin‐film texture, strain, and phase characterization , 1988 .

[5]  M. Korhonen,et al.  Stress evolution due to electromigration in confined metal lines , 1993 .

[6]  H. Tsuchikawa,et al.  Stress distribution in an aluminum interconnect of very large scale integration , 1990 .

[7]  Barbara Greenebaum,et al.  Stress in metal lines under passivation; comparison of experiment with finite element calculations , 1991 .

[8]  T. Sullivan Stress-Induced Voiding in Microelectronic Metallization: Void Growth Models and Refinements , 1996 .

[9]  P. Flinn,et al.  Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines , 1996 .

[10]  Chien Chiang,et al.  X‐ray diffraction determination of the effect of various passivations on stress in metal films and patterned lines , 1990 .

[11]  P. Flinn,et al.  Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history , 1987, IEEE Transactions on Electron Devices.

[12]  F. G. Yost,et al.  Materials reliability issues in microelectronics , 1991 .

[13]  J. J. Clement,et al.  Modeling electromigration‐induced stress evolution in confined metal lines , 1995 .

[14]  Yu‐Lin Shen,et al.  Thermal stresses in multilevel interconnections: Aluminum lines at different levels , 1997 .

[15]  Paul R. Besser,et al.  Stress-Induced Void Formation in Metal Lines , 1993 .

[16]  Stress relaxation in Al(Cu) thin films , 1996 .

[17]  Jeremias D. Romero,et al.  Outgassing behavior of spin-on-glass (SOG) , 1991 .

[18]  Yu‐Lin Shen MODELING OF THERMAL STRESSES IN METAL INTERCONNECTS : EFFECTS OF LINE ASPECT RATIO , 1997 .

[19]  Strain Analysis in Fine Al Interconnections by X-Ray Diffraction Spectrometry Using Micro X-Ray Beam , 1995 .

[20]  Subra Suresh,et al.  Large deformation and geometric instability of substrates with thin-film deposits , 1997 .

[21]  W. D. Nix,et al.  Thermal stresses in aluminum lines bounded to substrates , 1992 .

[22]  Subra Suresh,et al.  Stresses, curvatures, and shape changes arising from patterned lines on silicon wafers , 1996 .

[23]  J. Bravman,et al.  An x-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling , 1994 .

[24]  Timothy A. Brunner,et al.  Elastic relationships in layered composite media with approximation for the case of thin films on a thick substrate , 1987 .

[25]  P. Ho,et al.  Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures , 1995 .

[26]  J. J. Clement,et al.  Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects , 1997 .

[27]  Joost J. Vlassak,et al.  Mechanical Behavior of Thin Films , 1996 .