With the advent of 5G functionality in mobile devices the need for having more space for IC packaging inside these devices is becoming critical. Devices with 5G functionality would require many more radios and hence many more IC packages, to support different cellular bands. Real estate allocation to mother board, battery and peripheral components will become premium consideration to enhance battery life and user experience of 5G capable mobile devices. We will discuss trends and benefits of doing Modules/System in Package (SiP) to fit in the same mother board space while enabling 5G functionality in the mobile devices. SiP can potentially enable bigger battery size keeping same form factor as current mobile devices.