New Method for solid‐state Bonding Between Ceramics and Metals

A new method, for solid-state bonding between ceramics and metals was developed. An interlayer, which is a composite of the materials to be bonded, is used. The technique can be applied to materials which cannot be bonded by conventional diffusion-bonding methods because of thermal-expansion mismatches. It is ex pecked that the bonded materials will have excellent thermal shock resistance.