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Microwave and millimeter-wave integrated circuits (MMICs) are of increasing importance in modern military and commercial wireless communication systems. Current trends are towards low-cost, high-density, multilevel, and multifunctional integration, covering millimeter and submillimeter wave regions. The integration of diverse sub-functions, such as light-wave devices, superconductor circuits, digital circuits and ferrite devices, together with conventional microwave or millimeter-wave devices, circuits and antennas, will allow implementation of large systems on a single chip. Research on advanced device concepts, 3-D interconnects, high-performance packaging methods, advanced CAD-tools, measurement and testing techniques, as well as material and fabrication technologies, are being directed to meet these new challenges.