Manufacturing Substrates with Embedded Passives

Passives account for a very large part of today's electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, computers and several critical defense devices. This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on organic multilayered substrates. A variety of thin film capacitor and resistors were utilized to manufacture high-performance embedded passives. The electrical properties of capacitors fabricated from polymer-ceramic nanocomposites showed a stable capacitance and low loss over a wide temperature range. We have designed and fabricated several printed wiring board (PWB) and flip-chip package test vehicles focusing on resistors and capacitors. Two basic capacitor cores were used for this study. One is a layer capacitor. The second capacitor in this case study was discrete capacitor. In both cases, capacitance values are defined by the feature size, thickness and diele...