论文信息 - Wafer Applied Underfill - Delivering Flip Chip to the Mainstream - 字舞流文

Wafer Applied Underfill - Delivering Flip Chip to the Mainstream

Frank Stepniak | Scott Post | Arun K. Chaudhuri | Matthew R. Walsh | Robert L. D. Zenner | Michael A. Kropp | Scott B. Charles | Robert B. Kinney | F. Bruce Li

[1] Pre-applied underfill adhesives for flip chip attachment , 2001 .