Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device

The concept of target impedance can be significantly improved, based on the rigorous closed-form expressions for transient supply voltage ripple excited by an integrated circuit (IC) switching current, for the power distribution network (PDN) with power traces that is commonly used in handheld devices. A systematic procedure for developing the target impedance is formulated, which is then applied to the PDN design of a handheld product. From measurements of transient IC switching currents, PDN impedance, and supply voltage ripple, it is shown that the proposed target impedance successfully correlates the PDN impedance in the frequency domain with the transient supply voltage ripple in the time domain.

[1]  V. Ricchiuti.  Power-supply decoupling on fully populated high-speed digital PCBs , 2001 .

[2]  Hannu Tenhunen,et al.  Fast modeling of core switching noise on distributed LRC power grid in ULSI circuits , 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

[3]  J. L. Prince,et al.  Simultaneous switching ground noise calculation for packaged CMOS devices , 1991 .

[4]  Peter Boyle,et al.  System power distribution network theory and performance with various noise current stimuli including impacts on chip level timing , 2009, 2009 IEEE Custom Integrated Circuits Conference.

[5]  Jun Fan,et al.  Measurement of multiple switching current components through a bulk decoupling capacitor using a lab-made low-cost current probe , 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

[6]  L. Li,et al.  Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network , 2012, IEEE Transactions on Electromagnetic Compatibility.

[7]  Kenji Araki,et al.  Improved target impedance and IC transient current measurement for power distribution network design , 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

[8]  I. Novak.  Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination , 1999 .

[9]  B. Archambeault,et al.  A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages , 2003 .

[10]  Tzong-Lin Wu,et al.  Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits , 2005 .

[11]  Joungho Kim,et al.  Power distribution networks for system-on-package: status and challenges , 2004, IEEE Transactions on Advanced Packaging.

[12]  Larry D. Smith,et al.  Power distribution system design methodology and capacitor selection for modern CMOS technology , 1999 .

[13]  Zhang Jin,et al.  Modeling of simultaneous switching noise in high speed systems , 2001, ECTC 2001.

[14]  A. Waizman,et al.  Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology , 2001 .