Raman spectroscopic assessments of structural orientation and residual stress in wurtzitic AlN film deposited on (0 0 1) Si

Abstract In this paper, polarized Raman spectroscopy is applied to quantitatively assess crystallographic alteration and interfacial residual stress with a micron-scale resolution in highly 〈0 0 0 1〉 oriented (textured) polycrystalline wurtzitic AlN films grown on (0 0 1)-oriented Si substrates. Raman selection rules for the wurtzite structure of AlN were explicitly put forward and a set of Raman tensor elements determined from experimentally retrieved angular dependences of Raman band intensities upon in-plane rotation measurements. An appreciably high degree of homogeneity in the AlN film (i.e., with respect to both in-plane and out-of-plane Euler angles, retrieved according to the proposed spectroscopic algorithm) could be observed in spectral line scans randomly selected on the cross-section of the film/substrate system. These characterizations indicated negligible structural alterations, such as grain tilting and twisting during film growth. However, a non-uniform stress distribution in the AlN film along the film thickness direction was found, which remained stored during manufacturing of the AlN film. A quite remarkable magnitude of compressive residual stress (∼−1.5 GPa) could be measured at the film/substrate interface. Finally, a Raman (non-destructive) statistical characterization of the film system in terms of micromechanical homogeneity by spectral surface mapping is presented, which provides a prompt overall view of the film quality. The proposed procedure should generally be applicable in crystallographic and micromechanical quality control of electronic film devices exhibiting a Raman spectrum.

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