NN-Based Key-Variable Selection Method for Enhancing Virtual Metrology Accuracy

This paper proposes an advanced key-variable selection method, the neural-network-based stepwise selection (NN-based SS) method, which can enhance the conjecture accuracy of the NN-based virtual metrology (VM) algorithms. Multi-regression-based (MR-based) SS method is widely applied in dealing with key-variable selection problems despite the fact that it may not guarantee finding the best model based on its selected variables. However, the variables selected by MR-based SS may be adopted as the initial set of variables for the proposed NN-based SS to reduce the SS process time. The backward elimination and forward selection procedures of the proposed NN-based SS are both performed by the designated NN algorithm used for VM conjecturing. Therefore, the key variables selected by NN-based SS will be more suitable for the said NN-based VM algorithm as far as conjecture accuracy is concerned. The etching process of semiconductor manufacturing is used as the illustrative example to test and verify the merits of the NN-based SS method. One-hidden-layered back-propagation neural networks (BPNN-I) are adopted for establishing the NN models used in the NN-based SS method and the VM conjecture models. Test results show that the NN model created by the selected variables of NN-based SS can achieve better conjecture accuracy than that of MR-based SS. Simple recurrent neural networks and generalized regression neural network are also tested and proved to be able to achieve similar results as those of BPNN-I.

[1]  T. Matsuura An application of neural network for selecting feature parameters in machinery diagnosis , 2004 .

[2]  Fan-Tien Cheng,et al.  Application development of virtual metrology in semiconductor industry , 2005, 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005..

[3]  Fan-Tien Cheng,et al.  Accuracy and Real-Time Considerations for Implementing Various Virtual Metrology Algorithms , 2008, IEEE Transactions on Semiconductor Manufacturing.

[4]  Giovanna Castellano,et al.  Variable selection using neural-network models , 2000, Neurocomputing.

[5]  Min-Hsiung Hung,et al.  A processing quality prognostics scheme for plasma sputtering in TFT-LCD manufacturing , 2006 .

[6]  Fan-Tien Cheng,et al.  A Novel Virtual Metrology Scheme for Predicting CVD Thickness in Semiconductor Manufacturing , 2007, IEEE/ASME Transactions on Mechatronics.

[7]  D.M. Tilbury,et al.  An Approach for Factory-Wide Control Utilizing Virtual Metrology , 2007, IEEE Transactions on Semiconductor Manufacturing.

[8]  Fan-Tien Cheng,et al.  Dual-Phase Virtual Metrology Scheme , 2007, IEEE Transactions on Semiconductor Manufacturing.

[9]  E W Steyerberg,et al.  Stepwise selection in small data sets: a simulation study of bias in logistic regression analysis. , 1999, Journal of clinical epidemiology.

[10]  Yi-Ting Huang,et al.  Importance of Data Quality in Virtual Metrology , 2006, IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics.

[11]  Wen‐Jun Zhang,et al.  Comparison of different methods for variable selection , 2001 .

[12]  James Moyne,et al.  Run-to-Run Control in Semiconductor Manufacturing , 2000 .

[13]  Jammalamadaka Introduction to Linear Regression Analysis (3rd ed.) , 2003 .

[14]  Anil K. Jain,et al.  Feature Selection: Evaluation, Application, and Small Sample Performance , 1997, IEEE Trans. Pattern Anal. Mach. Intell..