Technological drivers in data centers and telecom systems: Multiscale thermal, electrical, and energy management
暂无分享,去创建一个
Suresh V. Garimella | Tim Persoons | Justin A. Weibel | Lian-Tuu Yeh | T. Persoons | J. Weibel | S. Garimella | L. Yeh
[1] T. Brunschwiler,et al. 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips , 2010 .
[2] K. Yazawa,et al. Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal , 2012, 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
[3] T. Persoons,et al. A general correlation for the stagnation point Nusselt number of an axisymmetric impinging synthetic jet , 2011 .
[4] Suresh V. Garimella,et al. Cooling Performance of Arrays of Vibrating Cantilevers , 2009 .
[5] Yiping Wang,et al. Experimental and Numerical Study of Flow over a Cavity for Reduction of Buffeting Noise , 2012 .
[6] Tim Persoons,et al. General Reduced-Order Model to Design and Operate Synthetic Jet Actuators , 2012 .
[7] H. Reichl,et al. Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks , 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
[8] Suresh V. Garimella,et al. Enhancement of external forced convection by ionic wind , 2008 .
[9] Suresh V. Garimella,et al. Analysis and Prediction of the Thermal Performance of Piezoelectrically Actuated Fans , 2009 .
[10] E. Colgan,et al. A practical implementation of silicon microchannel coolers for high power chips , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..
[11] Sven Werner. District Heating and Cooling , 2013 .
[12] Morten Boje Blarke,et al. Thermal battery with CO2 compression heat pump: Techno-economic optimization of a high-efficiency Smart Grid option for buildings , 2012 .
[13] Suresh V. Garimella,et al. Analysis of evaporating mist flow for enhanced convective heat transfer , 2010 .
[14] Saurabh K. Shrivastava,et al. Real-time prediction of rack-cooling performance , 2006 .
[15] T. Persoons,et al. Heat Transfer in Adjacent Interacting Impinging Synthetic Jets , 2009 .
[16] Kerry Bernstein,et al. Thermomechanical modeling of 3D electronic packages , 2008, IBM J. Res. Dev..
[17] S. Garimella,et al. A comprehensive flow regime map for microchannel flow boiling with quantitative transition criteria , 2010 .
[18] Yuejun Zhao,et al. Planar Jumping-Drop Thermal Diodes , 2011 .
[19] Yuan Chen,et al. Integrated management of application performance, power and cooling in data centers , 2010, 2010 IEEE Network Operations and Management Symposium - NOMS 2010.
[20] T. Brunschwiler,et al. Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics , 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
[21] P. Harvey,et al. Thermal Development, Modeling and Characterization of the Cell Processor Module , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
[22] Zhenhua Liu,et al. Optimizing data center energy efficiency via ambient-aware IT workload scheduling , 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
[23] J. Murthy,et al. Dynamics of droplet motion under electrowetting actuation. , 2011, Langmuir : the ACS journal of surfaces and colloids.
[24] Jie Wei. Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future , 2011 .
[25] Cullen E. Bash,et al. DIMENSIONLESS PARAMETERS FOR EVALUATION OF THERMAL DESIGN AND PERFORMANCE OF LARGE-SCALE DATA CENTERS , 2002 .
[26] Christian Belady,et al. GREEN GRID DATA CENTER POWER EFFICIENCY METRICS: PUE AND DCIE , 2008 .
[27] Thomas Brunschwiler,et al. Toward five-dimensional scaling: How density improves efficiency in future computers , 2011, IBM J. Res. Dev..
[28] Suresh V. Garimella,et al. Ionic winds for locally enhanced cooling , 2007 .
[29] J. Koomey. Worldwide electricity used in data centers , 2008 .
[30] Ali Shakouri,et al. Nanoscale Thermal Transport and Microrefrigerators on a Chip , 2006, Proceedings of the IEEE.
[31] Amip J. Shah,et al. On the need for energy efficiency metrics that span integrated IT-facility infrastructures , 2011 .
[32] Lian-Tuu Yeh,et al. Thermal Management Challenges in Telecommunication Systems and Data Centers , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[33] Cullen E. Bash,et al. Data Center Workload Placement for Energy Efficiency , 2007 .
[34] Aie. Energy Balances of non-OECD Countries 2010 , 2010 .
[35] Anne Marsden,et al. International Organization for Standardization , 2014 .
[36] Suresh V Garimella,et al. Design of Integrated Nanostructured Wicks for High-Performance Vapor Chambers , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[37] T. Brunschwiler,et al. On the significance of developing boundary layers in integrated water cooled 3D chip stacks , 2012 .
[38] Cullen E. Bash,et al. A Data Center Environmental Advisory System , 2011 .
[39] Suresh V. Garimella,et al. Confined and Submerged Liquid Jet Impingement Heat Transfer , 1995 .
[40] S. Krishnan,et al. Design of Complex Structured Monolithic Heat Sinks for Enhanced Air Cooling , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[41] S. Garimella,et al. Electrical actuation of dielectric droplets , 2008 .
[42] R. H. Lyon,et al. Noise and Cooling in Electronics Packages , 2006 .
[43] D. Schlitz,et al. An Electro-Aerodynamic Solid-State Fan and Cooling System , 2008, 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
[44] M.J. Ellsworth,et al. The evolution of water cooling for IBM large server systems: Back to the future , 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
[45] Eric Masanet,et al. An Analysis of Measures to Reduce the Life-Cycle Energy Consumption and Greenhouse Gas Emissions of California's Personal Computers , 2007 .
[46] Suresh V. Garimella,et al. Characterization of evaporation and boiling from sintered powder wicks fed by capillary action , 2010 .
[47] S.V. Garimella,et al. Pressure and Flow Rate Performance of Piezoelectric Fans , 2009, IEEE Transactions on Components and Packaging Technologies.
[48] Vaibhav Bahadur,et al. Electrowetting-based control of static droplet states on rough surfaces. , 2007, Langmuir : the ACS journal of surfaces and colloids.
[49] Jukka Paakki. A Practical Implementation of DCGs (Abstract) , 1990, CC.
[50] Martin H. Weik. A SECOND SURVEY OF DOMESTIC ELECTRONIC DIGITAL COMPUTING SYSTEMS.. , 1957 .