Monte Carlo Simulation of the Electrodeposition of Copper II. Acid Sulfate Solution with Blocking Additive

Simulation of copper electrodeposition in the presence of a hypothetical blocking additive was carried out by a linked continuum/ noncontinuum numerical code for various geometric configurations in the shape of a rectangular trench. The mechanism of copper electrodeposition described in Part 1 of this series was extended to include a single additive species. The hypothetical additive had the property that it blocks deposition hut is consumed at the surface, and that its arrival at the electrode surface is transport-limited so that leveling occurs. With use of numerical simulations carried out with a linked Monte Carlo-finite difference code described in Part I, the effect on trench in-fill of additive concentration, adsorption rate, consumption (breakdown) rate, and trench aspect ratio was investigated.

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