COB Package and Its Manufacturing method

By using a common PCB material to the substrate can significantly reduce the manufacturing cost, it is provided by increasing the heating effect from a light source substrate on which way the quality of the light source can be obtained at a low cost and a production package. The present invention, in the package substrate equipped with a light source, a substrate made of a general PCB; Holes formed in the substrate; A light source including the mounting aids (Sub-mount) is located at said hole; Includes, providing a package substrate and a manufacturing method arranged to close contact to mount the auxiliary chassis sphere of the light source; and covering the light source dome part made of a resin fixing the light source to the substrate. According to the present invention, while using as a substrate a general PCB material instead of a metal substrate can be obtained, improving the heating efficiency, and thus can be produced the package substrate of high quality at a low cost thereof. In addition, by greatly increasing the heating effect from the light source to obtain an effect to greatly improve the emission efficiency of the light source to obtain a high quality of the light source. FR4, package substrate, mounting aids (Sub-mount), the dome portion, method of producing the package substrate