A $D$ -Band Packaged Antenna on Organic Substrate With High Fault Tolerance for Mass Production

A grid array antenna working around 145 GHz is proposed in this paper. The antenna is built on liquid crystal polymer (LCP) and designed for the D-band antenna-in-package application. The intrinsic softness of the LCP material is a limiting factor of the antenna's aperture size. A 0.5-mm-thick copper core is used to compensate. By doing this, the rigidness of the antenna is effectively improved, compared with an antenna without the copper core. Wet etching is used to realize the patterns on the top and bottom conductor. Compared with a low-temperature cofired ceramic counterpart, we obtain a considerable cost reduction with acceptable performance. The proposed antenna has an impedance bandwidth of 136-157 GHz, a maximum gain of 14.5 dBi at 146 GHz, and vertical beams in the broadside direction between 141 and 149 GHz. The fabrication procedures of the antennas are introduced, and a parametric study is carried out, which shows the antenna's robustness against fabrication tolerances, such as the not-well-controlled etching rate and the substrate surface roughness. This makes the antenna a promising solution for mass production.

[1]  Yue Ping Zhang,et al.  Grid Antenna Arrays , 2016 .

[2]  Filippo Capolino,et al.  Design of a CMOS On-Chip Slot Antenna With Extremely Flat Cavity at 140 GHz , 2011, IEEE Antennas and Wireless Propagation Letters.

[3]  Yinggang Li,et al.  Integration of a 140 GHz Packaged LTCC Grid Array Antenna With an InP Detector , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[4]  G. Ponchak,et al.  A 60-GHz Active Receiving Switched-Beam Antenna Array With Integrated Butler Matrix and GaAs Amplifiers , 2012, IEEE Transactions on Microwave Theory and Techniques.

[5]  Amin Arbabian,et al.  A 135GHz SiGe transmitter with a dielectric rod antenna-in-package for high EIRP/channel arrays , 2014, Proceedings of the IEEE 2014 Custom Integrated Circuits Conference.

[6]  K. Ng,et al.  Millimeter-Wave Low Temperature Co-Fired Ceramic Leaky-Wave Antenna and Array Based on the Substrate Integrated Image Guide Technology , 2014, IEEE Transactions on Antennas and Propagation.

[7]  J. Cressler,et al.  A D-Band Micromachined End-Fire Antenna in 130-nm SiGe BiCMOS Technology , 2015, IEEE Transactions on Antennas and Propagation.

[8]  Duixian Liu,et al.  Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications , 2009, IEEE Transactions on Antennas and Propagation.

[9]  P. Heydari,et al.  Designs of fully on-chip antennas in (Bi)CMOS technology , 2012, 2012 IEEE International Workshop on Antenna Technology (iWAT).

[10]  Yong Huang,et al.  A Novel Antenna-in-Package With LTCC Technology for W-Band Application , 2014, IEEE Antennas and Wireless Propagation Letters.

[11]  T. Zwick,et al.  Probe based antenna measurements up to 325 GHz for upcoming millimeter-wave applications , 2013, 2013 International Workshop on Antenna Technology (iWAT).

[12]  Xianming Qing,et al.  140-GHz ${\rm TE}_{20}$-Mode Dielectric-Loaded SIW Slot Antenna Array in LTCC , 2013, IEEE Transactions on Antennas and Propagation.

[13]  Duixian Liu,et al.  A Ball Grid Array Package With a Microstrip Grid Array Antenna for a Single-Chip 60-GHz Receiver , 2011, IEEE Transactions on Antennas and Propagation.

[14]  J. Cressler,et al.  Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.