Integrated passive elements on low cost MCM-D substrates

Next generation wireless communiaction terminals will demand the use of advanced component integration process and high density packaging technologies in order to reduce size and to increase performance. The ability of the MCM-D low-cost Large Area Panel Processing technology to provide controlled impedance, microstrip, coplanar structures and integrated thin film passive components with useful performance in the microwave frequency regime is reported in this paper. This technologyis the 4 layer metallisation 12×12 in 2 and 24×24in 2 panels MCM-D developed for digital applications. We show that it is also able to realize RF functions through the integration of of a range of integrated inductors and capacitors. Representative equivalent circuit models for these models are discussed. The analysis of different design options and design parameters for planar spiral inductors is also considered. Special attention is given to the costs driven by area consumption and yield loss.

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