Tiny (0.72 mm2) pressure sensor integrating MEMS and CMOS LSI with back-end-of-line MEMS platform
暂无分享,去创建一个
[1] N. Yokoyama,et al. Fully CMOS compatible on-LSI capacitive pressure sensor fabricated using standard back-end-of-line processes , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..
[2] A. Witvrouw,et al. A 10 μm thick poly-SiGe gyroscope processed above 0.35 μm CMOS , 2007, 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS).
[3] S. Sherman,et al. Single-chip surface-micromachined integrated gyroscope with 50/spl deg//hour root Allan variance , 2002, 2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315).
[4] Gang Zhang,et al. A post-CMOS micromachined lateral accelerometer , 2002 .