论文信息 - Solder fatigue of Wafer Level package assemblies. Comparison with flip chip BGA’S - 字舞流文

Solder fatigue of Wafer Level package assemblies. Comparison with flip chip BGA’S

P. Schwindenhammer | H. Frémont | C. Regard | C. Gautier | A. Val | F. Roullier | P. Poirier