Advanced devices and packaging of Si-photonics-based optical transceiver for optical interconnection

High integration of photonics circuits and electronic circuits is expected in Si photonics technology. The small size of integrated photonics circuits is expected to lead to low costs and high-density optical interconnection. On the other hand, reduction in packaging costs will become vital toward lowering costs because of the demand for highly accurate assembly processes in optical coupling. Harmony between integrated devices and packaging design should be consider to realize miniature size and low cost transceiver. We propose advanced devices and Packaging of an Si-photonics-based optical transceiver for optical interconnection.