Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders

Sn-3.0Ag-0.5Cu (SAC305) alloy is the most widely used solder in electronic assemblies. However, issues associated with cost and drop/shock durability have resulted in a search for alternative lead-free solder alloys. One approach to improve the drop/shock reliability has been to reduce the silver content in Sn-Ag-Cu alloys. Another approach is doping Sn-Ag-Cu solder with additional elements. In 2008, the International Electronics Manufacturing Initiative (iNEMI) started the “Characterization of Pb-Free Alloy Alternatives” project to provide a comprehensive study of 15 tin-based solder interconnect compositions benchmarked against the eutectic tin-lead solder. For this study, temperature cycle durability was the primary focus and solders were selected to study the effect of varying silver content, microalloy additions, and aging. This paper reports the findings from one of the test conditions conducted under the iNEMI project. The cycles to failure for a temperature cycling test condition from −15°C to 125...

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