Buckle delamination on patterned substrates

[1]  W. Eccleston,et al.  Mater. Res. Soc. Symp. Proc. , 2006 .

[2]  W. Nix,et al.  Stress induced delamination methods for the study of adhesion of Pt thin films to Si , 2004 .

[3]  Anthony G. Evans,et al.  The characterization of telephone cord buckling of compressed thin films on substrates , 2002 .

[4]  B. Audoly,et al.  THE EUROPEAN PHYSICAL JOURNAL B c○ EDP Sciences , 2001 .

[5]  Anthony G. Evans,et al.  An experimental study of the influence of imperfections on the buckling of compressed thin films , 2002 .

[6]  Experiments with in-situ thin film telephone cord buckling delamination propagation , 2002 .

[7]  J. Hutchinson,et al.  Influence of substrate compliance on buckling delamination of thin films , 2002 .

[8]  I. Sheinman,et al.  Straight-sided, buckling-driven delamination of thin films at high stress levels , 2001 .

[9]  B. Cotterell,et al.  Buckling and cracking of thin films on compliant substrates under compression , 2000 .

[10]  B. Audoly.  STABILITY OF STRAIGHT DELAMINATION BLISTERS , 1999 .

[11]  Kwang-Ryeol Lee,et al.  A method of determining the elastic properties of diamond-like carbon films , 1999 .

[12]  M. Thouless.  Combined Buckling and Cracking of Films , 1993 .

[13]  H. Jensen.  Energy release rates and stability of straight-sided, thin-film delaminations , 1993 .

[14]  M. D. Thouless,et al.  Growth and configurational stability of circular, buckling-driven film delaminations , 1992 .

[15]  Z. Suo,et al.  Mixed mode cracking in layered materials , 1991 .

[16]  B. Rau,et al.  Buckling instability and adhesion of carbon layers , 1984 .