Three dimensional silicon triple-hot-wire anemometer based on polyimide joints

The first three dimensional (3D) flow sensor probe based on polyimide joints has been fabricated and successfully tested. The new 3D sensor, which is specially designed for turbulent gas flow measurements, is based on the anemometer principle, i.e. gas cooling of electrically heated hot-wires. The sensor probe consists of three perpendicular 500 /spl mu/m/spl times/5 /spl mu/m/spl times/2 /spl mu/m polysilicon hot-wires giving a measuring volume sufficiently small to resolve the small eddies in a turbulent flow. A bulk micromachining process in combination with sacrificial etching is used to form the hot-wire probes. The hot-wires are connected to 30 /spl mu/m thick bulk silicon beams which are defined by double sided KOH etching. Two wires (x and y) are located in the wafer plane and the third z-wire is rotated out of the plane using a new robust micro-joint. The self-assembly micro-joint with small bending radius is based on thermal shrinkage of polyimide in V-grooves. High flow sensitivity for the anemometric hot-wires has been measured. Time constants of 120 and 330 /spl mu/s were measured for the cooling and heating of the hot-wires, respectively.

[1]  Ernest Otto Doebelin,et al.  Measurement Systems Application and Design , 1966 .

[2]  G. Stemme A monolithic gas flow sensor with polyimide as thermal insulator , 1986, IEEE Transactions on Electron Devices.

[3]  M. Zanini,et al.  A micromachined, silicon mass-air-flow sensor for automotive applications , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.

[4]  Lennart Löfdahl,et al.  Silicon based flow sensors used for mean velocity and turbulence measurements , 1992 .

[5]  Lennart Löfdahl,et al.  A small-size silicon microphone for measurements in turbulent gas flows , 1994 .

[6]  G. Stemme,et al.  An Integrated Pressure-flow Sensor For Correlation Measurements In Turbulent Gas Flows , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

[7]  Pasqualina M. Sarro,et al.  Double Pass Metallization For Cmos Aluminum Actuators , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

[8]  K. Pister,et al.  3D structures with piezoresistive sensors in standard CMOS , 1995, Proceedings IEEE Micro Electro Mechanical Systems. 1995.

[9]  Peter Enoksson,et al.  Vibration modes of a resonant silicon tube density sensor , 1996 .

[10]  Peter Enoksson,et al.  New structure for corner compensation in anisotropic KOH etching , 1997 .

[11]  T. Ebefors,et al.  New robust small radius joints based on thermal shrinkage of polyimide in V-grooves , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[12]  G. Stemme,et al.  Dynamic actuation of polyimide V-groove joints by electrical heating , 1998 .