Structure-based equivalent circuit modeling of a capacitive-type MEMS microphone
暂无分享,去创建一个
[1] Jaewoo Lee,et al. A surface-micromachined MEMS acoustic sensor with back-plate anchors of 100 µm depth , 2011, 2011 IEEE SENSORS Proceedings.
[2] Zhijian Li,et al. Design and fabrication of silicon condenser microphone using corrugated diaphragm technique , 1996 .
[3] J. Bergqvist. Finite-element modelling and characterization of a silicon condenser microphone with a highly perforated backplate , 1993 .
[4] Hong-Ching Her,et al. Acoustic analysis and fabrication of microelectromechanical system capacitive microphones , 2008 .
[5] Jun Ma,et al. On the single-chip condenser miniature microphone using DRIE and backside etching techniques , 2003 .
[6] Weileun Fang,et al. Design and Implementation of a Capacitive-Type Microphone With Rigid Diaphragm and Flexible Spring Using the Two Poly Silicon Micromachining Processes , 2011, IEEE Sensors Journal.
[7] Harri eACT ilmansy. Equivalent circuit representation of electromechanical transducers: I. Lumped-parameter systems , 1996 .
[8] Wouter Olthuis,et al. A review of silicon microphones , 1994 .
[9] Rongming Lin,et al. Modeling and characterization of a silicon condenser microphone , 2004 .
[10] J. Bergqvist,et al. A silicon condenser microphone using bond and etch-back technology , 1994 .
[11] T. Brosnihan,et al. A MEMS Condenser Microphone for Consumer Applications , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.
[12] A. Ando,et al. High-Performance Condenser Microphone With Single-Crystalline Silicon Diaphragm and Backplate , 2007, IEEE Sensors Journal.