Reply to Comments on "Dose Perturbation by Wafer Charging During Ion Implantation"

Addition of appropriate surfactant to developer will im- prove wettability of the developer, thus promoting dissolution uni- formity of exposed photoresist. Surface smoothness of the Si substrate is also improved when developer contains surfactant. The only disad- vantage is that surfactant is adsorbed onto the water surface; however, it can be removed by a R-H20, treatment without degrading the pho- toresist pattern. The optimal tetramethylammonium hydroxide (TMAH) concentra- tion in the developer was investigated by measuring the developing se- lectivity of the photoresist against various TMAH concentration levels. The developing selectivity is considered to directly affect the photore- sist profile and resolution in the development prncess.

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