Suppression of Parallel Plate Modes in Low Frequency Microstrip Circuit Packages Using Lid of Printed Zigzag Wires
暂无分享,去创建一个
[1] E. Rajo-Iglesias,et al. New Microstrip Gap Waveguide on Mushroom-Type EBG for Packaging of Microwave Components , 2012, IEEE Microwave and Wireless Components Letters.
[2] E. Rajo-Iglesias,et al. Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[3] Per-Simon Kildal,et al. Correlation and capacity of MIMO systems and mutual coupling, radiation efficiency, and diversity gain of their antennas: simulations and measurements in a reverberation chamber , 2004, IEEE Communications Magazine.
[4] Ladislau Matekovits,et al. Electromagnetic bandgap solution for mitigation of parallel‐plate noise in power distribution networks , 2012 .
[5] D. Dawn,et al. A novel electromagnetic bandgap metal plate for parallel plate mode suppression in shielded structures , 2002, IEEE Microwave and Wireless Components Letters.
[6] E. Rajo-Iglesias,et al. Local Metamaterial-Based Waveguides in Gaps Between Parallel Metal Plates , 2009, IEEE Antennas and Wireless Propagation Letters.
[7] Eva Rajo-Iglesias,et al. Numerical studies of bandwidth of parallel-plate cut-off realised by a bed of nails, corrugations and mushroom-type electromagnetic bandgap for use in gap waveguides , 2011 .
[8] Jorge R. Costa,et al. Electromagnetic Characterization of Textured Surfaces Formed by Metallic Pins , 2008, IEEE Transactions on Antennas and Propagation.
[9] C. A. Fernandes,et al. Experimental demonstration of a structured material with extreme effective parameters at microwaves , 2008, 0810.4597.
[10] George V. Eleftheriades,et al. Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits , 2003 .
[11] P.-S. Kildal,et al. Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails , 2010, IEEE Microwave and Wireless Components Letters.
[12] Ahmed A. Kishk,et al. Numerical Prepackaging with PMC Lid - Efficient and Simple Design Procedure for Microstrip Circuits Including the Packaging , 2012 .
[13] C. Fischer,et al. Planar artificial magnetic conductors and patch antennas , 2003 .