Wafer-level vacuum sealing for packaging of silicon photonic MEMS
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Wim Bogaerts | Göran Stemme | Moises Jezzini | Kristinn B. Gylfason | Niels Quack | Frank Niklaus | Peter Verheyen | Simon J. Bleiker | Hamed Sattari | Pierre Edinger | Xiaojing Wang | Alain Yuji Takabayashi | Gaehun Jo | P. Verheyen | S. J. Bleiker | G. Stemme | F. Niklaus | W. Bogaerts | N. Quack | H. Sattari | Pierre Edinger | A. Takabayashi | Xiaojing Wang | M. Jezzini | K. Gylfason | Gaehun Jo | S. Bleiker
[1] D. W. Burns,et al. Planar processed polysilicon sealed cavities for pressure transducer arrays , 1984, 1984 International Electron Devices Meeting.
[2] Roland W. Gooch,et al. Wafer-level vacuum packaging for MEMS , 1999 .
[3] Khalil Najafi. Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS , 2003, SPIE MOEMS-MEMS.
[4] K. Najafi,et al. Transfer of metal MEMS packages using a wafer-level solder transfer technique , 2005, IEEE Transactions on Advanced Packaging.
[5] R. Soref,et al. The Past, Present, and Future of Silicon Photonics , 2006, IEEE Journal of Selected Topics in Quantum Electronics.
[6] M. Esashi,et al. Wafer level packaging of MEMS , 2008, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
[7] Chao Li,et al. Review of Silicon Photonics Foundry Efforts , 2014, IEEE Journal of Selected Topics in Quantum Electronics.
[8] Niclas Roxhed,et al. Integrating MEMS and ICs , 2015 .
[9] Peter De Heyn,et al. 50Gb/s silicon photonics platform for short-reach optical interconnects , 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).
[10] P. Verheyen,et al. Active Components for 50 Gb/s NRZ-OOK Optical Interconnects in a Silicon Photonics Platform , 2017, Journal of Lightwave Technology.
[11] S. J. Bleiker,et al. Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint , 2017, Journal of Microelectromechanical Systems.
[12] S. J. Bleiker,et al. Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages , 2019, Journal of Microelectromechanical Systems.
[13] Wim Bogaerts,et al. MORPHIC: programmable photonic circuits enabled by silicon photonic MEMS , 2020, OPTO.
[14] Kristinn B. Gylfason,et al. MEMS-Enabled Silicon Photonic Integrated Devices and Circuits , 2020, IEEE Journal of Quantum Electronics.